Invention Grant
- Patent Title: Angular displacement sensor of compliant material
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Application No.: US14511073Application Date: 2014-10-09
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Publication No.: US09222764B2Publication Date: 2015-12-29
- Inventor: Shawn P. Reese
- Applicant: Bend Labs, Inc.
- Applicant Address: US UT South Salt Lake City
- Assignee: Bend Labs, Inc.
- Current Assignee: Bend Labs, Inc.
- Current Assignee Address: US UT South Salt Lake City
- Agency: Lowenstein Sandler LLP
- Main IPC: G01B7/30
- IPC: G01B7/30 ; G01B7/00 ; A61B5/107 ; G01B7/16 ; G01L1/14

Abstract:
Disclosed is a sensing device that includes a flexible substrate having an elongated structure extending between a first end and a second end, the elongated structure being compliant material that is flexible and bendable from a linear, non-bent position to multiple bendable positions. The sensing device also includes a first compliant strain sensing element embedded within the compliant material and extending between the first end and the second end along a longitudinal length of the elongated structure. The first compliant strain sensing element includes a second compliant material that is flexible and bendable, where an electrical property of the first compliant strain sensing element changes in proportion to an applied strain on the elongated structure.
Public/Granted literature
- US20150054527A1 ANGULAR DISPLACEMENT SENSOR OF COMPLIANT MATERIAL Public/Granted day:2015-02-26
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