Invention Grant
- Patent Title: Semiconductor apparatus
- Patent Title (中): 半导体装置
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Application No.: US14528383Application Date: 2014-10-30
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Publication No.: US09224662B2Publication Date: 2015-12-29
- Inventor: Takuya Kadoguchi , Takahiro Hirano , Tomomi Okumura , Keita Fukutani , Masayoshi Nishihata
- Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA , DENSO CORPORATION
- Applicant Address: JP Toyota JP Kariya
- Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA,DENSO CORPORATION
- Current Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA,DENSO CORPORATION
- Current Assignee Address: JP Toyota JP Kariya
- Agency: Oliff PLC
- Priority: JP2013-253583 20131206; JP2014-046593 20140310
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/047 ; H01L23/495 ; H01L21/56 ; H01L23/051 ; H01L23/433 ; H01L23/31
Abstract:
A semiconductor apparatus is disclosed, which includes a semiconductor element provided on a plane; a sealing resin that seals the semiconductor element; a terminal that is electrically connected to the semiconductor element and includes a part that projects from a predetermined surface of the sealing resin; and a concave portion that is recessed toward a side of the semiconductor element from the predetermined surface, when viewed in a direction perpendicular to the plane. A side of the concave portion on the side of the semiconductor element includes a rounded shape, when viewed in the direction perpendicular to the plane.
Public/Granted literature
- US20150162274A1 SEMICONDUCTOR APPARATUS Public/Granted day:2015-06-11
Information query
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