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Invention Grant
US09224666B2 Circuit arrangement for a thermally conductive chip assembly and a manufacturing method 有权
用于导热芯片组件的电路装置和制造方法

Circuit arrangement for a thermally conductive chip assembly and a manufacturing method
Abstract:
The circuit arrangement according to the invention provides a substrate (10), a connecting element (18) and a chip (16). The substrate (10) provides at least a partial metallisation (11) on its surface. The connecting element (18) is applied to the metallisation (11). The chip (16) is applied to the connecting element (18). The connecting element (18) provides an electrically non-conductive glass layer (14), which is applied directly to the metallisation (11), and an adhesive layer (15) between the chip (16) and the glass layer (14).
Abstract(Chinese):

根据本发明的电路装置提供了一种衬底（10），一个连接元件（18）和一个芯片（16）。 衬底（10）在其表面上提供至少部分金属化（11）。 连接元件（18）被施加到金属化（11）。 芯片（16）被施加到连接元件（18）上。 连接元件（18）提供直接施加到金属化（11）的非导电玻璃层（14）和在芯片（16）和玻璃层（14）之间的粘合剂层（15）。

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