Invention Grant
- Patent Title: Multi-die integrated circuits implemented using spacer dies
- Patent Title (中): 使用间隔管芯实现多芯片集成电路
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Application No.: US14100749Application Date: 2013-12-09
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Publication No.: US09224697B1Publication Date: 2015-12-29
- Inventor: Woon-Seong Kwon , Suresh Ramalingam
- Applicant: Xilinx, Inc.
- Applicant Address: US CA San Jose
- Assignee: XILINX, INC.
- Current Assignee: XILINX, INC.
- Current Assignee Address: US CA San Jose
- Agent Kevin T. Cuenot
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00
Abstract:
An integrated circuit includes an interposer die having a surface, a first die mechanically and electrically attached to the surface of the interposer die, and a second die only mechanically attached to the surface of the interposer die using a die attach adhesive.
Information query
IPC分类:
