Invention Grant
US09224722B2 Semiconductor apparatus capable of detecting whether pad and bump are stacked
有权
能够检测焊盘和凸块是否堆叠的半导体装置
- Patent Title: Semiconductor apparatus capable of detecting whether pad and bump are stacked
- Patent Title (中): 能够检测焊盘和凸块是否堆叠的半导体装置
-
Application No.: US14265961Application Date: 2014-04-30
-
Publication No.: US09224722B2Publication Date: 2015-12-29
- Inventor: Soo Bin Lim , Jong Chern Lee
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2014-0006653 20140120
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L25/18 ; H01L25/065 ; H01L23/00 ; H01L23/498
Abstract:
A semiconductor apparatus may include a semiconductor chip, and the semiconductor chip may include a first pad, a second pad, and a bump. The first pad may be configured to receive a signal from an external device, and the second pad may include first and second metal layers electrically isolated from each other. The bump may be stacked over the second pad, and may be configured to receive a signal from a controller chip.
Public/Granted literature
- US20150206867A1 SEMICONDUCTOR APPARATUS HAVING PAD AND BUMP Public/Granted day:2015-07-23
Information query
IPC分类:
