An imaging apparatus includes a sensor chip, a substrate, upper and lower signal processing chips and connection boards. The sensor chip has pad electrodes to which electrical signals to be supplied to a pixel array are input. The substrate has first wiring patterns connected to signal lines, to which signals of the pixel array are output, and second wiring patterns connected to pad electrodes. The upper and lower signal processing chips have pad electrodes to which signals processed by signal processing circuits are output. The connection boards have FPC wiring electrically connected to the pad electrodes and FPC wiring electrically connected to the second wiring patterns formed on the substrate.