Invention Grant
- Patent Title: Silicon carbide semiconductor device
- Patent Title (中): 碳化硅半导体器件
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Application No.: US14692458Application Date: 2015-04-21
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Publication No.: US09224816B2Publication Date: 2015-12-29
- Inventor: Keiji Wada , Toru Hiyoshi , Masaki Furumai , Mitsuhiko Sakai , Kosuke Uchida
- Applicant: Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori
- Priority: JP2014-105489 20140521; JP2014-105490 20140521
- Main IPC: H01L31/0312
- IPC: H01L31/0312 ; H01L29/16 ; H01L29/06 ; H01L29/36

Abstract:
A silicon carbide semiconductor device includes a silicon carbide layer, an element region including a semiconductor element portion formed in the silicon carbide layer, a JTE region (first electric field relaxing region), an insulating film disposed on a first main surface and covering the JTE region, and a pad electrode electrically connected to the JTE region. The pad electrode includes an extension portion extending from an end of the JTE region close to the element region in a peripheral direction from the element region toward the JTE region, the extension portion being disposed on the insulating film. The extension portion overlies at least a portion of the JTE region.
Public/Granted literature
- US20150340443A1 SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2015-11-26
Information query
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