Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13957330Application Date: 2013-08-01
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Publication No.: US09224850B2Publication Date: 2015-12-29
- Inventor: Masakazu Goto , Shigeru Kawanaka , Akira Hokazono , Tatsuya Ohguro , Yoshiyuki Kondo
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Toyko
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Toyko
- Agency: Holtz, Holtz, Goodman & Chick PC
- Priority: JP2013-076256 20130401
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/739 ; H01L21/8234

Abstract:
In one embodiment, a first main terminal region of a first conductivity type and a second main terminal region of a second conductivity type, which is an opposite conductivity type of the first conductivity type, formed in the semiconductor substrate so as to sandwich a gate electrode, a diffusion layer of the second conductivity type coming in contact with the first and second element isolation insulator films and having an upper surface in a position deeper than lower surfaces of the first and second main terminal regions, a first well region of the first conductivity type formed between the first main terminal region and the diffusion layer, and a second well region of the first conductivity type formed between the second main terminal region and the diffusion layer. The second well region has a impurity concentration higher than that of the first well region.
Public/Granted literature
- US20140291736A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-10-02
Information query
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