Invention Grant
- Patent Title: Waterproof ear jack socket and method of manufacturing the same
- Patent Title (中): 防水耳塞插座及其制造方法
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Application No.: US14213870Application Date: 2014-03-14
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Publication No.: US09225105B2Publication Date: 2015-12-29
- Inventor: Hyunmi Cheong , Uyhyeon Jeong , Jaeshik Kim , Kwangjin Bae
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co. Ltd
- Current Assignee: Samsung Electronics Co. Ltd
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2013-0027171 20130314
- Main IPC: H01R13/52
- IPC: H01R13/52 ; H01R24/58 ; H01R43/00 ; H01R13/504 ; H01R13/74

Abstract:
A waterproof ear jack socket includes: an upper socket having at least one slit formed such that a first portion of a contact terminal passes through one surface of the upper socket to be exposed to the outside; a lower socket having a recess for engaging a second portion of the contact terminal on one surface thereof facing the upper socket, the lower socket being coupled to the upper socket to form a plug insertion hole into which an ear jack plug is inserted; and a waterproof cover attached to an outer circumference of a socket body formed by coupling the upper socket and the lower socket.
Public/Granted literature
- US20140273617A1 WATERPROOF EAR JACK SOCKET AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-09-18
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