Invention Grant
- Patent Title: Semiconductor laser device
- Patent Title (中): 半导体激光器件
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Application No.: US13826061Application Date: 2013-03-14
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Publication No.: US09225146B2Publication Date: 2015-12-29
- Inventor: Shingo Masui , Yasuhiro Kawata , Tsuyoshi Hirao
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi
- Agency: Foley & Lardner LLP
- Priority: JPP2012-065430 20120322; JPP2013-050746 20130313
- Main IPC: H01S5/223
- IPC: H01S5/223 ; H01S5/042 ; H01S5/16 ; H01S5/22

Abstract:
The present invention is aimed to prevent occurrence of COD and rapid degradation of light output in semiconductor laser devices. The semiconductor laser device includes a semiconductor laser element 100A and a support member 200. The semiconductor laser element 100a includes a first electrode 13, a substrate 11, and a semiconductor structure 12 having an emitting facet and a reflecting facet, a second electrode 15, and a pad 16, in this order. The semiconductor laser element 100A is connected to a support member 200 at its pad 16 side via a connecting member 300. The emitting-side end portion of the second electrode 15 is spaced apart from the emitting facet of the semiconductor structure 12, and the emitting-side end portion of the pad 16 is located at an outer side than the emitting-side end portion the second electrode 15.
Public/Granted literature
- US20140204969A1 SEMICONDUCTOR LASER DEVICE Public/Granted day:2014-07-24
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