Invention Grant
- Patent Title: Microwave backhaul system having a dual channel over a single interconnect
- Patent Title (中): 微波回程系统在单个互连上具有双通道
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Application No.: US13615913Application Date: 2012-09-14
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Publication No.: US09225500B2Publication Date: 2015-12-29
- Inventor: Kobi Sturkovich , Igal Kushnir
- Applicant: Kobi Sturkovich , Igal Kushnir
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H04L5/14
- IPC: H04L5/14 ; H04L27/02 ; H04L27/36

Abstract:
A microwave backhaul architecture having a dual channel over a single interconnect is provided. The backhaul architecture includes an indoor communication unit and an outdoor communication unit (ODU), which may include an N-Plexer configured to perform decouple one or more transmitted signals from one or more received signals. The ODU also includes an RF module, an analog-to-digital/digital-to-analog converter (ADC/DAC) and a digital signal processor (DSP) configured to process received data in the digital domain such that errors may be detected and/or corrected. Further, the backhaul architecture is configured to allow two transmission channels and two receipt channels to coexist on the single interconnect. The single interconnect may be implemented such that the two transmission and receipt Channels may support communication at a highest possible baud rate. Thus, the single interconnect allows for data to be communicated to the ODU over two communication channels, without having to add an additional interconnect.
Public/Granted literature
- US20130135986A1 Microwave Backhaul System Having a Dual Channel Over a Single Interconnect Public/Granted day:2013-05-30
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