Invention Grant
US09226404B2 PCB board, core for manufacturing the PCB board and method for manufacturing the PCB board
有权
PCB板,制造PCB板的芯片和PCB板的制造方法
- Patent Title: PCB board, core for manufacturing the PCB board and method for manufacturing the PCB board
- Patent Title (中): PCB板,制造PCB板的芯片和PCB板的制造方法
-
Application No.: US13790724Application Date: 2013-03-08
-
Publication No.: US09226404B2Publication Date: 2015-12-29
- Inventor: Bing Ai , Biao Hu
- Applicant: NVIDIA CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: NVIDIA Corporation
- Current Assignee: NVIDIA Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Artegis Law Group, LLP
- Priority: CN201210440188 20121107
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/09 ; H05K1/00 ; H05K3/06 ; H05K1/02 ; H05K3/00

Abstract:
The present invention provides a printed circuit board (PCB) board, a core for manufacturing the PCB board and a method for manufacturing the PCB board. The PCB board is in a shape of a rectangle and comprises a fiber layer formed of interlacedly weaved fiberglasses, a metal layer affixed onto a surface of the fiber layer, and a pair of differential signal traces formed on the metal layer, wherein extending directions of the fiberglasses lie at acute angles with respect to a length direction of the rectangle, and the pair of differential signal traces extends along a width direction or the length direction of the rectangle. The PCB board can effectively reduce the possibility of the skew distortion during the transmitting process of the differential signal through adjusting the angle between the fiberglasses and the edge of the core without adjusting or redesigning the original circuit layout.
Public/Granted literature
- US20140124249A1 PCB BOARD, CORE FOR MANUFACTURING THE PCB BOARD AND METHOD FOR MANUFACTURING THE PCB BOARD Public/Granted day:2014-05-08
Information query