Invention Grant
- Patent Title: Flexible circuit assemblies
- Patent Title (中): 柔性电路组件
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Application No.: US13748150Application Date: 2013-01-23
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Publication No.: US09226688B2Publication Date: 2016-01-05
- Inventor: Brad Jacobsen , Bruce M. Burg , Abhishek Jain , Andrew Bzostek
- Applicant: Medtronic Xomed, Inc.
- Applicant Address: US FL Jacksonville
- Assignee: MEDTRONIC XOMED, INC.
- Current Assignee: MEDTRONIC XOMED, INC.
- Current Assignee Address: US FL Jacksonville
- Agency: Harness, Dickey
- Main IPC: A61B5/055
- IPC: A61B5/055 ; A61B5/06 ; H05K1/02 ; A61B19/00 ; A61M1/00 ; A61B17/24 ; A61B17/00

Abstract:
A flexible circuit assembly can include a base layer, a plurality of circuit traces and an insulative layer. The plurality of circuit traces can each be coupled to a pair of circuit pads, and the circuit traces can be formed on an upper side of the base layer. The insulative layer can be formed over the circuit traces to isolate the circuit traces from an external environment. The base layer, plurality of circuit traces and insulative layer can form a flexible circuit sheet. The base layer and the insulative layer can include material properties and a thickness configured to facilitate the flexible circuit sheet being flexible such that the flexible circuit sheet is adapted to conform to a non-planar surface of the medical device.
Public/Granted literature
- US20130137954A1 Flexible Circuit Sheet Public/Granted day:2013-05-30
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