Invention Grant
US09227076B2 Molded headers for implantable signal generators, and associated systems and methods
有权
用于可植入信号发生器的模制头,以及相关系统和方法
- Patent Title: Molded headers for implantable signal generators, and associated systems and methods
- Patent Title (中): 用于可植入信号发生器的模制头,以及相关系统和方法
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Application No.: US14268575Application Date: 2014-05-02
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Publication No.: US09227076B2Publication Date: 2016-01-05
- Inventor: Vivek Sharma , Jon Parker , Yougandh Chitre , Andre B. Walker
- Applicant: Nevro Corporation
- Applicant Address: US CA Redwood City
- Assignee: Nevro Corporation
- Current Assignee: Nevro Corporation
- Current Assignee Address: US CA Redwood City
- Agency: Perkins Coie LLP
- Main IPC: A61N1/375
- IPC: A61N1/375 ; A61N1/378 ; A61N1/372

Abstract:
Molded headers, implantable signal generators having molded headers, and associated systems and methods are disclosed herein. An implantable signal generator in accordance with a particular embodiment includes a can having a shell and a battery positioned at least partially within the shell. An output terminal can be operably coupled to the battery and positioned to provide electrical power to a signal delivery device. A pre-molded header having a plurality of openings can be coupled to the can, and the output terminal can be positioned at least partially within an individual opening.
Public/Granted literature
- US20140330346A1 MOLDED HEADERS FOR IMPLANTABLE SIGNAL GENERATORS, AND ASSOCIATED SYSTEMS AND METHODS Public/Granted day:2014-11-06
Information query
IPC分类: