Invention Grant
- Patent Title: Plating catalyst and method
- Patent Title (中): 电镀催化剂和方法
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Application No.: US13732271Application Date: 2012-12-31
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Publication No.: US09227182B2Publication Date: 2016-01-05
- Inventor: Wenjia Zhou , Suk Kwan Kwong , Dennis Chit Yiu Chan , Dennis Kwok Wai Yee , Weijuan Zhou
- Applicant: Rohm and Haas Electronic Materials LLC
- Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee: Rohm and Haas Electronic Materials LLC
- Agent John J. Piskorski
- Main IPC: C23C18/30
- IPC: C23C18/30 ; B01J31/06 ; C23C18/18 ; C23C18/40 ; H05K3/42
Abstract:
A solution including a precious metal nanoparticle and a polymer polymerized from a monomer comprising at least a monomer having two or more carboxyl groups or carboxylic acid salt groups. The solution is useful for a catalyst for a process of electroless plating of a metal on non-conductive surface.
Public/Granted literature
- US20130171366A1 PLATING CATALYST AND METHOD Public/Granted day:2013-07-04
Information query
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