Invention Grant
- Patent Title: Lead-free solder alloy having reduced shrinkage cavities
- Patent Title (中): 无铅焊料合金减少了缩孔
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Application No.: US12736625Application Date: 2009-04-23
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Publication No.: US09227258B2Publication Date: 2016-01-05
- Inventor: Yuji Kawamata , Minoru Ueshima , Min Kang , Kayako Nakagawa , Yasuaki Kokubu
- Applicant: Yuji Kawamata , Minoru Ueshima , Min Kang , Kayako Nakagawa , Yasuaki Kokubu
- Applicant Address: JP Tokyo
- Assignee: SENJU METAL INDUSTRY CO., LTD.
- Current Assignee: SENJU METAL INDUSTRY CO., LTD.
- Current Assignee Address: JP Tokyo
- Agent Michael Tobias
- Priority: JP2008-112282 20080423
- International Application: PCT/JP2009/058077 WO 20090423
- International Announcement: WO2009/131178 WO 20091029
- Main IPC: B23K35/22
- IPC: B23K35/22 ; B23K1/00 ; B23K1/20 ; B23K35/02 ; B23K35/26 ; B23K35/362 ; C22C13/02 ; H01L23/488 ; H05K3/34 ; H01L23/498
Abstract:
A lead-free solder alloy having improved surface properties which suppresses minute irregularities and shrinkage cavities has a composition consisting essentially of Ag: 0.1-1.5%, Bi: 2.5-5.0%, Cu: 0.5-1.0%, optionally Ni: 0.015-0.035% and/or at least one of Ge and Ga: 0.0005-0.01%, and a remainder of Sn and unavoidable impurities.
Public/Granted literature
- US20110204121A1 LEAD-FREE SOLDER ALLOY HAVING REDUCED SHRINKAGE CAVITIES Public/Granted day:2011-08-25
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