Approaches to a solder ball bonding (SBB) tool and a method for solder ball bonding work pieces. The SBB tool comprises a rotatable feed plate for transporting solder balls from a reservoir to a nozzle, which is a position at which a laser light source can irradiate and melt the solder balls. The melted solder ball is then ejected from the nozzle and onto one or more work pieces, for electrically interconnecting the work pieces. The feed plate is configured with first holes and second holes, the first holes for receiving and transporting solder balls and the second holes for providing an aperture for the laser light to irradiate the solder balls, as the feed plate rotates and the holes are moved to positions in relation to the reservoir and the nozzle.