Invention Grant
- Patent Title: Warm bond method for butt joining metal parts
- Patent Title (中): 用于对接金属部件的热粘合方法
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Application No.: US14459032Application Date: 2014-08-13
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Publication No.: US09227267B1Publication Date: 2016-01-05
- Inventor: Paul A. Dion , Gregg A. Dion
- Applicant: William Engineering LLC
- Applicant Address: US MA North Attleboro
- Assignee: William Engineering LLC
- Current Assignee: William Engineering LLC
- Current Assignee Address: US MA North Attleboro
- Agency: Wilmer Cutler Pickering Hale and Dorr LLP
- Main IPC: B23K20/00
- IPC: B23K20/00 ; B23K20/04 ; B23K11/14 ; B23K20/02 ; B23K31/02 ; C22C38/00 ; C22C38/18 ; B23K11/02

Abstract:
A method of solid phase bonding metal pieces by securing a first and second metal pieces in edge to edge contact; subjecting the first and second metal pieces to a first upset comprising heating the first and second edges to a temperature in the range of 0.35-0.95 of the melting temperature of the first and second metal pieces and applying a first axil force to the first and second metal pieces to urge the first and second edges together, to upset the metal at the edge to edge contact and form a bond; and subjecting the bonded metal piece to a second upset comprising heating the bonded metal piece between secured locations to a temperature in the range of 0.35-0.95 of the melting temperature of the metal and applying a second axil force to the bonded metal piece to upset the bonded metal piece and form a solid phase bond.
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