Invention Grant
US09227274B1 Joining via nano-scale reinforced bonding media: materials, procedures and applications thereof
有权
通过纳米级增强粘合介质连接:其材料,程序和应用
- Patent Title: Joining via nano-scale reinforced bonding media: materials, procedures and applications thereof
- Patent Title (中): 通过纳米级增强粘合介质连接:其材料,程序和应用
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Application No.: US13963197Application Date: 2013-08-09
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Publication No.: US09227274B1Publication Date: 2016-01-05
- Inventor: Anagi Manjula Balachandra , Parviz Soroushian , Mohammad Sayyar Bidgoli
- Applicant: Anagi Manjula Balachandra , Parviz Soroushian , Mohammad Sayyar Bidgoli
- Assignee: METNA CO
- Current Assignee: METNA CO
- Main IPC: B23K35/24
- IPC: B23K35/24 ; B23K35/32 ; B23K35/02 ; B23K35/28 ; B23K35/26

Abstract:
Method of joining articles using microscale brazing alloy particles reinforced with slender nanomaterials is described. Surface modified graphite nanomaterials were dispersed in a medium comprised of metal alloy particles, this dispersion was introduced at the interface between the joining articles followed by heating under ultra high vacuum. The nanomaterial-to-metal alloy surface contacts were enhanced by at least one of fusion, embedment and chemical reaction phenomena under high temperature and ultra high vacuum yielding true nanocomposite at the interface. The fusion, embedment and chemical reaction phenomena enhance at least one of the mechanical, electrical, thermal, durability and functional attributes of these contact points, which translate into improved properties of the joined article. The enhanced contact points enable effective use of the distinct qualities of nanomaterials towards development of joints which offer unique balances of strength, ductility, toughness, energy absorption, thermal stability, weathering resistance and other characteristics.
Public/Granted literature
- US20150367617A1 Joining via Nano-Scale Reinforced Bonding Media: Materials, Procedures and Applications Thereof Public/Granted day:2015-12-24
Information query
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