Invention Grant
- Patent Title: Slicing apparatus and method of use thereof
- Patent Title (中): 切片装置及其使用方法
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Application No.: US13914391Application Date: 2013-06-10
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Publication No.: US09227333B2Publication Date: 2016-01-05
- Inventor: Quin Marceau
- Applicant: Quin Marceau
- Agency: Gordon Rees Scully Mansukhani LLP
- Main IPC: B26B27/00
- IPC: B26B27/00 ; A21D15/04 ; A21C15/04

Abstract:
A slicing apparatus comprises a housing and at least one filament with a first and second end. The at least one filament is pullable by a user. The housing is defined by perimeter walls and has a bottom with an opening, a top, and a vertical member. The vertical member has a longitudinal axis and extends from the top of the housing towards the bottom. The at least one filament mechanically connects to the vertical member and the remainder of it passes through the perimeter walls. Once passed through, the second end of the at least one filament terminates external to the housing. With the second end of the at least one filament now external to the housing, the user can move the at least one filament. When the at least one filament is moved by a user, the at least one filament may effect slices into a volume of matter.
Public/Granted literature
- US20140360022A1 SLICING APPARATUS AND METHOD OF USE THEREOF Public/Granted day:2014-12-11
Information query
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