Invention Grant
US09227347B2 Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly
有权
制造散热器组件的方法,由此制成的散热器组件以及使用散热器组件的照明器
- Patent Title: Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly
- Patent Title (中): 制造散热器组件的方法,由此制成的散热器组件以及使用散热器组件的照明器
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Application No.: US13775442Application Date: 2013-02-25
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Publication No.: US09227347B2Publication Date: 2016-01-05
- Inventor: Narendra Anand Hardikar , Harindranath K. Sharma
- Applicant: SABIC Innovative Plastics IP B.V.
- Applicant Address: NL
- Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
- Current Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
- Current Assignee Address: NL
- Agency: Cantor Colburn LLP
- Main IPC: F21V29/00
- IPC: F21V29/00 ; H01J1/62 ; B29C45/14 ; F21V29/89 ; H01L23/373 ; H01L33/64 ; F21Y101/02

Abstract:
In an embodiment, a method of making a heat sink assembly can include: forming a heat sink assembly comprising a polymer heat sink around a metal insert, the polymer heat sink comprising a thermally conductive polymer material, wherein the heat sink assembly has a contact pressure between the polymer heat sink and the metal insert; and increasing the contact pressure. In an embodiment, a method of making a heat sink assembly includes: heating a mold and subsequently introducing a metal insert to the mold, wherein the metal insert has an insert temperature of 30° C. to 70° C. when it is inserted into the mold; closing the mold; and in less than or equal to 10 seconds of closing the mold, over-molding the metal insert with a thermally conductive polymer material to form a heat sink assembly.
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