Invention Grant
US09227375B2 Process for bonding two parts subjected to tensile forces, bonded parts obtained
有权
接合两个受拉力的部件,获得的接合部件的工艺
- Patent Title: Process for bonding two parts subjected to tensile forces, bonded parts obtained
- Patent Title (中): 接合两个受拉力的部件,获得的接合部件的工艺
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Application No.: US14057021Application Date: 2013-10-18
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Publication No.: US09227375B2Publication Date: 2016-01-05
- Inventor: Noel Carrere , Anatole Ciccone
- Applicant: EPSILON COMPOSITE
- Applicant Address: FR Gaillan en Medoc
- Assignee: EPSILON COMPOSITE
- Current Assignee: EPSILON COMPOSITE
- Current Assignee Address: FR Gaillan en Medoc
- Agency: Young & Thompson
- Priority: FR1259920 20121018
- Main IPC: F16B7/00
- IPC: F16B7/00 ; B32B1/08 ; F16B11/00 ; B29L31/06 ; B29C65/48 ; B29C65/54 ; B29C65/00 ; F16C7/02

Abstract:
A process for producing a bonded connection between first and a second parts, with a length of superposition around a longitudinal axis, these parts being subjected to forces in at least one longitudinal direction, includes producing a bonded connection having at least one interior and/or exterior adhesive joint, over the length between the parts, the joint having a cross-section around the longitudinal axis, the thickness of the joint varying from a free edge on the end-fitting side, to the other free edge on the tube side, and following the direction of forces to which the parts are subjected so as to better distribute the overstresses over at least one part of the length. At least one adhesive joint is produced, having in the longitudinal direction a large thickness facing each of two free edges relative to the thickness in a median part.
Public/Granted literature
- US20140112708A1 PROCESS FOR BONDING TWO PARTS SUBJECTED TO TENSILE FORCES, BONDED PARTS OBTAINED Public/Granted day:2014-04-24
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