Invention Grant
- Patent Title: Highly flexible near-infrared metamaterials
- Patent Title (中): 高度灵活的近红外超材料
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Application No.: US13726183Application Date: 2012-12-23
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Publication No.: US09227383B2Publication Date: 2016-01-05
- Inventor: Kok Wai Cheah , Guixin Li
- Applicant: Hong Kong Baptist University
- Applicant Address: HK Kowloon Tong, Kowloon
- Assignee: HONG KONG BAPTIST UNIVERSITY
- Current Assignee: HONG KONG BAPTIST UNIVERSITY
- Current Assignee Address: HK Kowloon Tong, Kowloon
- Agency: Ella Cheong Hong Kong
- Agent Sam T. Yip
- Main IPC: B32B27/36
- IPC: B32B27/36 ; G02B1/00 ; G02F1/01

Abstract:
A novel multilayer flexible metamaterial that can work at near infrared (NIR) regime that can be fabricated on transparent PET substrate using flip chip transfer (FCT) technique. An embodiment of the present invention also provides novel NIR metamaterial device that can be transformed into various shapes by bending the PET substrate, wherein said metamaterial device is tunable via physical manipulation of its flexible substrate with no requirement to change the material composition of the substrate. The flexibility allows the novel NIR metamaterial device to bend and stretch, which can alter the device structure. Since the resonant frequency of each device is a function of the device structure, the resonant frequency can be tuned by the bend and stretch of the substrate. Another embodiment of the present invention further provides novel tunable sensors and emitters using such flexible metamaterials and devices.
Public/Granted literature
- US20130177775A1 Highly Flexible Near-infrared Metamaterials Public/Granted day:2013-07-11
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