There is provided a method by which it is possible to precisely process a translucent rigid substrate laminate. The method for processing a translucent rigid substrate laminate includes the steps of: preparing a translucent rigid substrate laminate by adhering two or more translucent rigid substrates with photocurable adhering agent; fixing the laminate to a cradle with predetermined adhesive; performing processing A for cutting the laminate, which is fixed to the cradle, in a thickness direction and forming a desired number of divided translucent rigid substrate laminates, or performing desired outline processing B on the laminate which is fixed to the cradle; and peeling the processed translucent rigid substrate laminate from the cradle by applying external force without heating the translucent rigid substrate laminate at 40° C. or more.