Invention Grant
- Patent Title: Method for manufacturing resin-based composite material
- Patent Title (中): 制造树脂基复合材料的方法
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Application No.: US13808983Application Date: 2011-06-03
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Publication No.: US09227386B2Publication Date: 2016-01-05
- Inventor: Hidetaka Hattori , Hideki Horizono , Takaaki Sato , Tadashi Yazaki
- Applicant: Hidetaka Hattori , Hideki Horizono , Takaaki Sato , Tadashi Yazaki
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2010-160910 20100715
- International Application: PCT/JP2011/062768 WO 20110603
- International Announcement: WO2012/008235 WO 20120119
- Main IPC: B32B37/10
- IPC: B32B37/10 ; B29C43/12 ; B29C43/36 ; B29C70/44 ; B29C70/46 ; B29C43/20 ; B29K105/08

Abstract:
A method for manufacturing a resin-based composite material includes: a stage in which prepregs are stacked on a jig; a stage in which the stacked prepregs and the jig are covered and pressurized heat treatment is applied thereto to form a first semi-molded article and a second semi-molded article; a stage in which board thicknesses of the first semi-molded article and the second semi-molded article are measured, a stage in which the number of additional plies is determined based on the measured board thicknesses, a desired board thickness of the resin-based composite material, and physical properties of the additional plies; and a stage in which a layered product is formed by stacking the predetermined number of additional plies between the first semi-molded article and the second semi-molded article, the layered product and the jig are covered with a bagging material, and pressurized heat treatment is applied thereto.
Public/Granted literature
- US20130112335A1 METHOD FOR MANUFACTURING RESIN-BASED COMPOSITE MATERIAL Public/Granted day:2013-05-09
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