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US09227387B2 Electronic component mounting system, electronic component mounting method, and electronic component mounting machine 有权
电子部件安装系统，电子部件安装方法和电子部件安装机

Electronic component mounting system, electronic component mounting method, and electronic component mounting machine
Abstract:
In an electronic component mounting method, a light-emitting element is temporarily fixed to a board by solder paste and adhesive, the adhesive is cured to fix a main body of the light-emitting element to the board, and solder is melted to bond a terminal of the light-emitting element to the board. The method includes: detecting a positional deviation of an emission portion in a top surface of the light-emitting element; detecting a position of the light-emitting element in a state in which the light-emitting element is held by an absorption nozzle; positioning the emission portion to a prescribed position on the board based on the positional deviation and the position of the light-emitting element; mounting the light-emitting element on the board at a position deviated from the prescribed position by the positional deviation; curing the adhesive; and heating the board to melt the solder.
Abstract(Chinese):

在电子部件安装方法中，通过焊膏和粘合剂将发光元件临时固定在基板上，将粘合剂固化，将发光元件的主体固定在基板上，并将焊料熔化以结合 发光元件的端子到板。 该方法包括：检测发光元件的顶表面中的发射部分的位置偏差; 在由吸收喷嘴保持发光元件的状态下检测发光元件的位置; 基于位置偏差和发光元件的位置将发射部分定位在板上的规定位置; 通过位置偏差将发光元件安装在板上位于偏离规定位置的位置上; 固化粘合剂; 并加热板以熔化焊料。

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