Invention Grant
- Patent Title: Pressure sensor and manufacture method thereof
- Patent Title (中): 压力传感器及其制造方法
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Application No.: US14596985Application Date: 2015-01-14
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Publication No.: US09227832B1Publication Date: 2016-01-05
- Inventor: Yu-Hao Chien , Li-Tien Tseng
- Applicant: MiraMEMS Sensing Technology Co., Ltd.
- Applicant Address: CN Suzhou
- Assignee: MIRAMEMS SENSING TECHNOLOGY CO., LTD
- Current Assignee: MIRAMEMS SENSING TECHNOLOGY CO., LTD
- Current Assignee Address: CN Suzhou
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW103121912A 20140625
- Main IPC: H01L21/54
- IPC: H01L21/54 ; B81B3/00 ; B81B7/00 ; B81C1/00

Abstract:
A pressure sensor using the MEMS element and the manufacture method thereof utilize the semiconductor processes to form the micro channel connecting to the chamber, open the micro channel, coat the anti-sticking layer on the inner surface of the chamber, and then seal the micro channel to keep the chamber airtight. Therefore, the manufacture method may essentially simplify the process to coat the anti-sticking layer on the inner surface of the airtight chamber to prevent the sticking and failing of the movable MEMS element.
Public/Granted literature
- US20150375988A1 PRESSURE SENSOR AND MANUFACTURE METHOD THEREOF Public/Granted day:2015-12-31
Information query
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