Invention Grant
- Patent Title: Sensor and method for manufacturing a sensor
- Patent Title (中): 用于制造传感器的传感器和方法
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Application No.: US14609737Application Date: 2015-01-30
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Publication No.: US09227837B2Publication Date: 2016-01-05
- Inventor: Jochen Reinmuth
- Applicant: Robert Bosch GmbH
- Applicant Address: DE Stuttgart
- Assignee: ROBERT BOSCH GMBH
- Current Assignee: ROBERT BOSCH GMBH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102014202923 20140218
- Main IPC: H01L29/84
- IPC: H01L29/84 ; B81B7/00 ; B81C1/00 ; B81B5/00 ; B81B3/00
Abstract:
A sensor includes: a substrate, a microelectromechanical structure, and a decoupling structure. The decoupling structure is anchored on the substrate, and the microelectromechanical structure is anchored on the decoupling structure. The microelectromechanical structure and the decoupling structure are movable in relation to the substrate. The decoupling structure is situated between the microelectromechanical structure and the substrate.
Public/Granted literature
- US20150232327A1 Sensor and Method for Manufacturing a Sensor Public/Granted day:2015-08-20
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