Invention Grant
- Patent Title: Cavity-type semiconductor package and method of packaging same
- Patent Title (中): 腔式半导体封装及其封装方法
-
Application No.: US14527421Application Date: 2014-10-29
-
Publication No.: US09227838B2Publication Date: 2016-01-05
- Inventor: Stephen R. Hooper , Philip H. Bowles
- Applicant: FREESCALE SEMICONDUCTOR, INC.
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee Address: US TX Austin
- Agent Charlene R. Jacobsen
- Main IPC: H01L23/10
- IPC: H01L23/10 ; B81B7/00 ; B81C1/00 ; H01L23/04 ; H01L23/053
Abstract:
A method (30) of forming a semiconductor package (20) entails applying (56) an adhesive (64) to a portion (66) of a bonding perimeter (50) of a base (22), with a section (68) of the perimeter (50) being without the adhesive (64). A lid (24) is placed on the base (22) so that a bonding perimeter (62) of the lid (24) abuts the bonding perimeter (50) of the base (22). The lid (24) includes a cavity (25) in which dies (38) mounted to the base (22) are located. A gap (70) is formed without the adhesive (64) at the section (68) between the base (22) and the lid (24). The structure vents from the gap (70) as air inside the cavity (25) expands during heat curing (72). Following heat curing (72), another adhesive (80) is dispensed in the section (68) to close the gap (70) and seal the cavity (25).
Public/Granted literature
- US20150061106A1 CAVITY-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF PACKAGING SAME Public/Granted day:2015-03-05
Information query
IPC分类:
