Invention Grant
US09227839B2 Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling
有权
晶圆级封装红外（IR）焦平面阵列（FPA）与ev逝波耦合
- Patent Title: Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling
- Patent Title (中): 晶圆级封装红外（IR）焦平面阵列（FPA）与ev逝波耦合
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Application No.: US14270945Application Date: 2014-05-06
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Publication No.: US09227839B2Publication Date: 2016-01-05
- Inventor: Roland W. Gooch , Stephen H. Black , Thomas A. Kocian , Adam M. Kennedy , Buu Q. Diep
- Applicant: Raytheon Company
- Applicant Address: US MA Waltham
- Assignee: RAYTHEON COMPANY
- Current Assignee: RAYTHEON COMPANY
- Current Assignee Address: US MA Waltham
- Agency: Daly, Crowley, Mofford & Durkee, LLP
- Main IPC: H01L23/02
- IPC: H01L23/02 ; B81B7/00 ; H01L37/00
Abstract:
A structure for detecting electromagnetic radiation having a predetermined wavelength. The structure includes a device wafer having a sensing element disposed on a predetermined region of a surface of the device wafer responsive to the electromagnetic radiation. A cover wafer is provided having a region thereof transparent to the electromagnetic radiation for passing the electromagnetic radiation through the transparent region onto a surface of the sensing element. A bond gap spacer structure is provided for supporting the surface of the sensing element from an opposing surface of the transparent region of the cover wafer a distance less than a fraction of the predetermined wavelength when the cover wafer is bonded to the device wafer.
Public/Granted literature
- US20150321905A1 WAFER LEVEL PACKAGED INFRARED (IR) FOCAL PLANE ARRAY (FPA) WITH EVANESCENT WAVE COUPLING Public/Granted day:2015-11-12
Information query
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