Invention Grant
US09227843B2 Methods of manufacturing a MEMS device having a backplate with elongated protrusions
有权
制造具有带有细长突起的背板的MEMS装置的方法
- Patent Title: Methods of manufacturing a MEMS device having a backplate with elongated protrusions
- Patent Title (中): 制造具有带有细长突起的背板的MEMS装置的方法
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Application No.: US14511652Application Date: 2014-10-10
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Publication No.: US09227843B2Publication Date: 2016-01-05
- Inventor: Alfons Dehe
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; B81C1/00 ; B81B3/00 ; H04R19/00
Abstract:
MEMS devices with a rigid backplate and a method of making a MEMS device with a rigid backplate are disclosed. In one embodiment, a device includes a substrate and a backplate supported by the substrate. The backplate includes elongated protrusions.
Public/Granted literature
- US20150024536A1 MEMS Device and Method of Manufacturing a MEMS Device Public/Granted day:2015-01-22
Information query
IPC分类:
