Invention Grant
US09228116B2 Thermosetting resin composition, thermosetting adhesive sheet, and method of producing thermosetting adhesive sheet
有权
热固性树脂组合物，热固性粘合片，以及热固性粘合片的制造方法
- Patent Title: Thermosetting resin composition, thermosetting adhesive sheet, and method of producing thermosetting adhesive sheet
- Patent Title (中): 热固性树脂组合物，热固性粘合片，以及热固性粘合片的制造方法
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Application No.: US14398607Application Date: 2013-05-28
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Publication No.: US09228116B2Publication Date: 2016-01-05
- Inventor: Daisuke Motomura
- Applicant: DEXERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DEXERIALS CORPORATION
- Current Assignee: DEXERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2012-129388 20120606
- International Application: PCT/JP2013/064721 WO 20130528
- International Announcement: WO2013/183486 WO 20131212
- Main IPC: B32B27/38
- IPC: B32B27/38 ; B05D5/10 ; C09J133/06 ; C09J163/00 ; C08G59/32 ; C08G59/38 ; C08G59/56 ; C08G59/66 ; C09J7/02 ; C08K5/00 ; C08K5/25 ; C08K5/37 ; C09J133/08
Abstract:
A thermosetting resin composition has good storage properties at room temperature and an unreacted epoxy resin etc. are less likely to exude therefrom during heat compression molding. The thermosetting resin composition contains an acrylic copolymer including an epoxy group-containing (meth)acrylate unit, an epoxy resin, and a curing agent for an epoxy resin. In this thermosetting resin composition, epoxy groups in at least the acrylic copolymer are partially cross-linked with an amine compound and a thiol compound having 2 to 4 thiol groups per molecule, and the curing agent for an epoxy resin is an organic acid dihydrazide.
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