A substrate support for receiving substrates or wafers to be processed and for transporting said substrates or wafers in or through processing installations has universal application, is easily adaptable for specific tasks and is economical in use of material. Within a frame made of longitudinal and transverse supports, a plurality of longitudinal and transverse members are arranged intersecting in a grid-like manner, such that a base grid for directly or indirectly receiving substrates is formed. Both the longitudinal and transverse supports and the longitudinal and transverse members are positively connected to one another.