Invention Grant
- Patent Title: Method of electroplating silver strike over nickel
- Patent Title (中): 电镀银镍的方法
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Application No.: US13239333Application Date: 2011-09-21
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Publication No.: US09228268B2Publication Date: 2016-01-05
- Inventor: Wan Zhang-Berlinger , Edit Szocs , Margit Clauss
- Applicant: Wan Zhang-Berlinger , Edit Szocs , Margit Clauss
- Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee: Rohm and Haas Electronic Materials LLC
- Agent John J. Piskorski
- Main IPC: C25D5/10
- IPC: C25D5/10 ; C25D5/12 ; C23C28/00 ; C25D3/46 ; C25D3/50
Abstract:
A silver electroplating solution is used to electroplate a mirror bright silver layer on a nickel or nickel alloy substrate. The silver electroplating solution is cyanide-free and environmentally friendly.
Public/Granted literature
- US20120067733A1 METHOD OF ELECTROPLATING SILVER STRIKE OVER NICKEL Public/Granted day:2012-03-22
Information query
