Invention Grant
- Patent Title: Fan assembly and airflow passage structure thereof
- Patent Title (中): 风机组件及其气流通道结构
-
Application No.: US13301408Application Date: 2011-11-21
-
Publication No.: US09228594B2Publication Date: 2016-01-05
- Inventor: Po-Hao Yu , Shir-Harn Yeh , Yi-Ming Wu
- Applicant: Po-Hao Yu , Shir-Harn Yeh , Yi-Ming Wu
- Applicant Address: TW Taoyuan Hsien
- Assignee: DELTA ELECTRONICS, INC.
- Current Assignee: DELTA ELECTRONICS, INC.
- Current Assignee Address: TW Taoyuan Hsien
- Agency: Kirton McConkie
- Agent Evan R. Witt
- Priority: TW099140190A 20101122
- Main IPC: F04D29/54
- IPC: F04D29/54 ; F01D25/24

Abstract:
An airflow passage structure is applied to a fan. The airflow passage structure includes a sidewall and an airflow channel. The sidewall has uneven thickness. The airflow channel is defined by an inner surface of the sidewall, and includes a channel entrance and a channel exit. The channel exit is in communication with an airflow inlet of the fan. The diameter of the airflow channel is non-uniformly distributed.
Public/Granted literature
- US20120128485A1 FAN ASSEMBLY AND AIRFLOW PASSAGE STRUCTURE THEREOF Public/Granted day:2012-05-24
Information query