Invention Grant
- Patent Title: Overpressure relief valve assembly
- Patent Title (中): 过压安全阀总成
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Application No.: US13451000Application Date: 2012-04-19
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Publication No.: US09228668B2Publication Date: 2016-01-05
- Inventor: Scott W. Simpson
- Applicant: Scott W. Simpson
- Applicant Address: US CT Windsor Locks
- Assignee: HAMILTON SUNDSTRAND CORPORATION
- Current Assignee: HAMILTON SUNDSTRAND CORPORATION
- Current Assignee Address: US CT Windsor Locks
- Agency: Cantor Colburn LLP
- Main IPC: F16K31/12
- IPC: F16K31/12 ; F16K17/06

Abstract:
An overpressure relief valve assembly includes an outer housing having an inlet at a first end opening to an inlet cavity and an outlet at an opposite second end opening to an outlet cavity, and a valve located in the outer housing, the valve including a valve housing that is fixed with respect to the outer housing and an actuator movable within the valve housing to alternatingly cut off and allow communication between the inlet cavity and the outlet cavity.
Public/Granted literature
- US20130276916A1 OVERPRESSURE RELIEF VALVE ASSEMBLY Public/Granted day:2013-10-24
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