Invention Grant
- Patent Title: Door harness attaching structure
- Patent Title (中): 门线束安装结构
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Application No.: US14477941Application Date: 2014-09-05
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Publication No.: US09228678B2Publication Date: 2016-01-05
- Inventor: Yoshitaka Higashi , Tetsuya Hirano , Hiroyuki Katayama , Masayoshi Kamenoue , Masaoki Yoshida
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Agent James E. Armstrong, IV; Brian S. Matross
- Priority: JP2013-187481 20130910
- Main IPC: F16L3/08
- IPC: F16L3/08 ; F16L3/06 ; B60J5/04 ; B60J9/00 ; F16L3/12 ; F16L5/00 ; B60R16/02

Abstract:
A door harness attaching structure includes: an opening provided on an inner panel of a hinge-open/close-type door; and a hole provided on an end wall at the hinge side of the inner panel. The opening is composed of a large main opening covered by a panel unit of a door module and a small sub opening continued to the main opening, notched toward the hole for attaching a grommet and covered by a cover member. A wiring harness of the door module includes: a harness portion projecting from the panel unit; and the grommet provided at a tip end of the harness portion and attached through the hole.
Public/Granted literature
- US20150069189A1 DOOR HARNESS ATTACHING STRUCTURE Public/Granted day:2015-03-12
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