Invention Grant
- Patent Title: Apparatus and method for contactless thickness measurement
- Patent Title (中): 非接触式厚度测量装置及方法
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Application No.: US13802198Application Date: 2013-03-13
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Publication No.: US09228826B2Publication Date: 2016-01-05
- Inventor: Han-Cheol Ryu , Namje Kim , Sang-Pil Han , Kyung Hyun Park , Hyunsung Ko , Jeong Woo Park
- Applicant: Electronics and Telecommunications Research Institute
- Applicant Address: KR Daejeon
- Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee Address: KR Daejeon
- Priority: KR10-2012-0095272 20120829; KR10-2012-0109025 20120928
- Main IPC: G01B11/06
- IPC: G01B11/06

Abstract:
A contactless thickness measuring apparatus is provided which includes an terahertz transmitter configured to receive the first optical path signal from the coupler and to generate a terahertz continuous wave using the first optical signal and an applied bias; an optical delay line configured to delay the second optical path signal output from the coupler; and an terahertz receiver configured to receive the terahertz continuous wave penetrating a sample and to detect an optical current using the terahertz continuous wave and the second optical path signal delayed. A thickness of the sample is a value corresponding to the optical current which phase value becomes a constant regardless of a plurality of measurement frequencies.
Public/Granted literature
- US20140061475A1 APPARATUS AND METHOD FOR CONTACTLESS THICKNESS MEASUREMENT Public/Granted day:2014-03-06
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