Invention Grant
US09228914B2 Composite material, formed body, electronic device with formed body, and method for manufacturing a formed body
有权
复合材料,成形体,具有成形体的电子装置,以及制造成型体的方法
- Patent Title: Composite material, formed body, electronic device with formed body, and method for manufacturing a formed body
- Patent Title (中): 复合材料,成形体,具有成形体的电子装置,以及制造成型体的方法
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Application No.: US13990512Application Date: 2011-11-23
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Publication No.: US09228914B2Publication Date: 2016-01-05
- Inventor: Thomas Uehlin , Andreas Rossberg , Sergej Lopatin
- Applicant: Thomas Uehlin , Andreas Rossberg , Sergej Lopatin
- Applicant Address: DE Hauptstr, Maulburg
- Assignee: Endress + Hauser GmbH + Co. KG
- Current Assignee: Endress + Hauser GmbH + Co. KG
- Current Assignee Address: DE Hauptstr, Maulburg
- Agency: Bacon & Thomas, PLLC
- Priority: DE102010062295 20101201
- International Application: PCT/EP2011/070812 WO 20111123
- International Announcement: WO2012/072465 WO 20120607
- Main IPC: G01L9/00
- IPC: G01L9/00 ; G01L19/06 ; C08K3/36 ; B01J20/26 ; B01J20/30 ; B01J20/28 ; B01J20/10

Abstract:
A composite material includes a polymer matrix and silica gel, which is bound in the polymer matrix. The volume fraction of the silica gel to the volume fraction of the composite material amounts to at least 50%, especially at least 65%. An electronic device, especially measuring device, includes at least one housing having at least one inner space, which contains an electronic circuit, wherein the device has at least one gas path, via which moisture can get into the housing, wherein the device has at least one formed body of the composite material.
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