Invention Grant
- Patent Title: Imprinted bi-layer micro-structure
- Patent Title (中): 印刷双层微结构
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Application No.: US14012269Application Date: 2013-08-28
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Publication No.: US09229260B2Publication Date: 2016-01-05
- Inventor: Ronald Steven Cok
- Applicant: Ronald Steven Cok
- Applicant Address: US NY Rochester
- Assignee: EASTMAN KODAK COMPANY
- Current Assignee: EASTMAN KODAK COMPANY
- Current Assignee Address: US NY Rochester
- Agent Raymond L. Owens
- Main IPC: H05K1/11
- IPC: H05K1/11 ; G02F1/1333 ; G06F3/041 ; H05K1/02 ; H05K3/46 ; H01L27/15 ; H01L27/32

Abstract:
An imprinted micro-structure includes a substrate having an edge area and a central area separate from the edge area. A cured bottom-layer, connecting layer, and top layer are formed over the substrate, each with a corresponding imprinted micro-channel having a cured micro-wire. The bottom micro-wire is in the central area and the edge area. The connecting-layer micro-wire contacts at least a portion of the bottom-layer micro-wire in the edge area. A cured edge micro-wire in the top layer contacts at least a portion of the connecting-layer micro-wire in the edge area. A top-layer micro-wire is located in a top-layer micro-channel and is separate from the edge micro-wire and bottom micro-wire. The bottom-layer micro-wire in the central area is electrically connected to the edge micro-wire in the edge area and is electrically isolated from the top-layer micro-wire.
Public/Granted literature
- US20150060112A1 IMPRINTED BI-LAYER MICRO-STRUCTURE Public/Granted day:2015-03-05
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