Invention Grant
- Patent Title: Array substrate, manufacturing method and display device thereof
- Patent Title (中): 阵列基板，其制造方法及其显示装置
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Application No.: US14016583Application Date: 2013-09-03
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Publication No.: US09229287B2Publication Date: 2016-01-05
- Inventor: Hyun Sic Choi , Jung Mok Jun
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., Ltd.
- Current Assignee: BOE TECHNOLOGY GROUP CO., Ltd.
- Current Assignee Address: CN Beijing
- Priority: CN201220445578U 20120903
- Main IPC: H01L29/205
- IPC: H01L29/205 ; G02F1/1362 ; G02F1/1343 ; G02F1/1335
Abstract:
The invention provides an array substrate, a manufacturing method and a display device thereof. The array substrate comprises a substrate, a gate line and a pixel electrode disposed on the substrate, a common electrode disposed above and overlaying the gate line, wherein a strip-shaped through hole is disposed on the common electrode and at least a portion of the strip-shaped through hole is positioned right above the gate line.
Public/Granted literature
- US20140061691A1 Array Substrate, Manufacturing Method And Display Device Thereof Public/Granted day:2014-03-06
Information query
IPC分类:
