Invention Grant
- Patent Title: Method of inspecting mask, mask inspection device, and method of manufacturing mask
-
Application No.: US14716213Application Date: 2015-05-19
-
Publication No.: US09229314B2Publication Date: 2016-01-05
- Inventor: Tsuneo Terasawa , Osamu Suga
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge P.C.
- Priority: JP2011-156288 20110715
- Main IPC: G03F1/22
- IPC: G03F1/22 ; G01N21/95 ; G01N21/88

Abstract:
There is provided a method of high-sensitively detecting both of a phase defect existing in a mask blank and a phase defect remaining after manufacturing an EUVL mask. When the mask blank is inspected, EUV light having illumination NA to be within an inner NA but a larger value is irradiated. When the EUVL mask is inspected, by using a dark-field imaging optical system including a center shielding portion for shielding EUV light and a linear shielding portion for shielding the EUV light whose width is smaller than a diameter of the center shielding portion, the center shielding portion and the linear shielding portion being included in a pupil plane, the EUV light having illumination NA as large as or smaller than the width of the linear shielding portion is irradiated.
Public/Granted literature
- US20150253658A1 METHOD OF INSPECTING MASK, MASK INSPECTION DEVICE, AND METHOD OF MANUFACTURING MASK Public/Granted day:2015-09-10
Information query