Invention Grant
- Patent Title: Covering structure, input device, and manufacturing method of covering structure
- Patent Title (中): 覆盖结构,输入装置和覆盖结构的制造方法
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Application No.: US14255887Application Date: 2014-04-17
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Publication No.: US09229537B2Publication Date: 2016-01-05
- Inventor: I-Heng Chen , Chung-Yao Lin , Yu-Hsiu Lin
- Applicant: CHICONY ELECTRONICS CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: Chicony Electronics Co., Ltd.
- Current Assignee: Chicony Electronics Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Priority: TW102149333A 20131231
- Main IPC: G06F1/16
- IPC: G06F1/16 ; G06F3/02 ; B32B5/24 ; B32B9/02 ; B32B9/04 ; B32B7/12

Abstract:
A covering structure including a bottom covering layer, a top covering layer, and a thermoplastic material layer is disclosed. The thermoplastic material layer is laminated between the bottom covering layer and the top covering layer. The thermoplastic material layer includes a first thermoplastic material layer part and a second thermoplastic material layer part that are connected to each other. The first thermoplastic material layer part has a first thickness. The second thermoplastic material layer part has a second thickness. The first thickness is larger than the thickness of the top covering layer. The first thickness is 4˜7 times of the second thickness. The disclosure further discloses an input device using the covering structure and a manufacturing method of the covering structure.
Public/Granted literature
- US20150185862A1 COVERING STRUCTURE, INPUT DEVICE, AND MANUFACTURING METHOD OF COVERING STRUCTURE Public/Granted day:2015-07-02
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