Invention Grant
US09229537B2 Covering structure, input device, and manufacturing method of covering structure 有权
覆盖结构,输入装置和覆盖结构的制造方法

Covering structure, input device, and manufacturing method of covering structure
Abstract:
A covering structure including a bottom covering layer, a top covering layer, and a thermoplastic material layer is disclosed. The thermoplastic material layer is laminated between the bottom covering layer and the top covering layer. The thermoplastic material layer includes a first thermoplastic material layer part and a second thermoplastic material layer part that are connected to each other. The first thermoplastic material layer part has a first thickness. The second thermoplastic material layer part has a second thickness. The first thickness is larger than the thickness of the top covering layer. The first thickness is 4˜7 times of the second thickness. The disclosure further discloses an input device using the covering structure and a manufacturing method of the covering structure.
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