Invention Grant
- Patent Title: Circuit marginality validation test for an integrated circuit
- Patent Title (中): 集成电路的电路边缘验证测试
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Application No.: US11694755Application Date: 2007-03-30
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Publication No.: US09229720B2Publication Date: 2016-01-05
- Inventor: Antonio Castro , Mohammad Al-Aqrabawi , Brad A. Kelly , Rehan Sheikh
- Applicant: Antonio Castro , Mohammad Al-Aqrabawi , Brad A. Kelly , Rehan Sheikh
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: G06F15/00
- IPC: G06F15/00 ; G06F7/38 ; G06F9/00 ; G06F9/44 ; G06F9/30 ; G06F9/38 ; G06F11/22

Abstract:
A high volume manufacturing (HVM) and circuit marginality validation (CMV) test for an integrated circuit (IC) is disclosed. The IC comprises a port binding and bubble logic in the front end to provide flexibility in binding a port to the uop and to create empty spaces (bubbles) in the uop flow. The out-of-order (OOO) cluster of the IC comprises reservation disable logic to control the flow sequence of the uops and stop schedule logic to temporarily stop dispatching the uops from the OOO cluster to the execution (EXE) cluster. The EXE cluster of the IC comprises signal event uops to generate fault information and fused uJump uops to specify combination of branch prediction, direction, and resolution in any portion of the test. Such features provide a tester the flexibility to perform HVM and CMV testing of the OOO and EXE clusters of the IC.
Public/Granted literature
- US20080244235A1 CIRCUIT MARGINALITY VALIDATION TEST FOR AN INTEGRATED CIRCUIT Public/Granted day:2008-10-02
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