Invention Grant
US09230458B2 Compound structural frame with integrally formed thermal cooling channels and method of using same 有权
具有整体形成的散热通道的复合结构框架及其使用方法

  • Patent Title: Compound structural frame with integrally formed thermal cooling channels and method of using same
  • Patent Title (中): 具有整体形成的散热通道的复合结构框架及其使用方法
  • Application No.: US14572342
    Application Date: 2014-12-16
  • Publication No.: US09230458B2
    Publication Date: 2016-01-05
  • Inventor: David Franklin CoxArne E. Carlson
  • Applicant: ADTI MEDIA, LLC
  • Applicant Address: US CA Temecula
  • Assignee: ADTI MEDIA, LLC
  • Current Assignee: ADTI MEDIA, LLC
  • Current Assignee Address: US CA Temecula
  • Agent Jerry R. Potts; James R. McDaniel
  • Main IPC: H05K7/20
  • IPC: H05K7/20 G09F9/33
Compound structural frame with integrally formed thermal cooling channels and method of using same
Abstract:
A support for plural display modules each including a rearwardly extending heat sink includes a compound structural frame that defines a frame frontside, a frame backside, and a vertical cooling conduit, the frame backside for mounting the structural frame to a mounting structure, the frame frontside defining a bay member, the bay member defining an opening that couples to the vertical cooling conduit, the bay member configured to receive and support one of the display modules with the heat sink extending through the opening and into the vertical cooling conduit whereby the display module is convectively cooled by the vertical motion of air through the cooling conduit.
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