Invention Grant
- Patent Title: Semiconductor memory device for use in multi-chip package
- Patent Title (中): 半导体存储器件用于多芯片封装
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Application No.: US14336689Application Date: 2014-07-21
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Publication No.: US09230610B2Publication Date: 2016-01-05
- Inventor: Mi-Young Woo , Myong-Jae Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2013-0152499 20131209
- Main IPC: G11C7/00
- IPC: G11C7/00 ; G11C5/02 ; G11C11/406 ; G11C8/12 ; G11C29/44

Abstract:
Provides is a multi-chip package including a plurality of semiconductor memory devices. Each of semiconductor memory devices includes a register and a control circuit. The register is configured to store start sequence information representing start of execution of a refresh operation in the multi-chip package. The control circuit is configured to control start of the execution of the refresh operation in response to the start sequence information stored in the register. Since the start of the execution of the refresh operation is performed in sequence of respective semiconductor memory devices according to the start sequence information stored in the register, consumption of peak current may be reduced in a power saving mode.
Public/Granted literature
- US20150162068A1 SEMICONDUCTOR MEMORY DEVICE FOR USE IN MULTI-CHIP PACKAGE Public/Granted day:2015-06-11
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