Invention Grant
- Patent Title: Conductive path structure and wire harness
- Patent Title (中): 导电路径结构和线束
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Application No.: US13819506Application Date: 2011-09-16
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Publication No.: US09230713B2Publication Date: 2016-01-05
- Inventor: Hideomi Adachi , Hidehiko Kuboshima , Yoshiaki Ozaki
- Applicant: Hideomi Adachi , Hidehiko Kuboshima , Yoshiaki Ozaki
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-207552 20100916; JP2011-190359 20110901
- International Application: PCT/JP2011/071781 WO 20110916
- International Announcement: WO2012/036319 WO 20120322
- Main IPC: H01B7/00
- IPC: H01B7/00 ; H01B3/30 ; H01H73/24 ; H01H85/04 ; H01H71/10 ; B60K28/14 ; B60K28/00 ; H01B7/32

Abstract:
A conductive path structure includes a conductor that includes a first conductive portion and a second conductive portion which are connected to each other through a cut-off facilitating portion, and an insulation member that covers the cut-off facilitating portion directly or indirectly. When the cut-off facilitating portion is cut off so as to separate the first conductive portion and the second conductive portion to each other due to an impact applied to the cut-off facilitating portion, the insulation member is configured so as to cover the separated first conductive portion and the separated second conductive portion.
Public/Granted literature
- US20130153292A1 CONDUCTIVE PATH STRUCTURE AND WIRE HARNESS Public/Granted day:2013-06-20
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