Invention Grant
- Patent Title: Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein
- Patent Title (中): 要嵌入板中的多层陶瓷电子部件和嵌入其中的多层陶瓷电子部件的印刷电路板
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Application No.: US14067734Application Date: 2013-10-30
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Publication No.: US09230740B2Publication Date: 2016-01-05
- Inventor: Eun Hyuk Chae , Byoung Hwa Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon, Gyunggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon, Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0084042 20130717
- Main IPC: H01G4/005
- IPC: H01G4/005 ; H01G4/30 ; H01G4/008 ; H01G2/06 ; H05K1/18 ; H05K3/00
Abstract:
There is provided a multilayer ceramic electronic part to be embedded in a board, including: a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other; first and second internal electrodes; and first and second external electrodes formed on both end portions of the ceramic body, wherein the first external electrode includes a first base electrode and a first terminal electrode formed on a portion of the first base electrode formed on at least one of the first and second main surfaces of the ceramic body, the second external electrode includes a second base electrode and a second terminal electrode formed on a portion of the second base electrode formed on at least one of the first and second main surfaces of the ceramic body.
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