Invention Grant
- Patent Title: Substrate treatment method
- Patent Title (中): 底物处理方法
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Application No.: US13427370Application Date: 2012-03-22
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Publication No.: US09230836B2Publication Date: 2016-01-05
- Inventor: Ayumi Higuchi , Yoshiyuki Fujitani , Takemitsu Miura , Rei Takeaki
- Applicant: Ayumi Higuchi , Yoshiyuki Fujitani , Takemitsu Miura , Rei Takeaki
- Applicant Address: JP
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2011-068078 20110325; JP2012-035298 20120221
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B08B3/04 ; B08B3/10 ; B08B3/02

Abstract:
A substrate treatment method that includes circulating a treatment liquid from a treatment vessel through a circulation path extending through a filter and a temperature controller, spouting the treatment liquid toward a substrate accommodated in the treatment vessel to recover the treatment liquid in the treatment vessel, and controlling the liquid surface level of the treatment liquid retained in the treatment vessel below the substrate held at a substrate treatment position.
Public/Granted literature
- US20120240958A1 SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD Public/Granted day:2012-09-27
Information query
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