Invention Grant
- Patent Title: Redistribution layers for microfeature workpieces, and associated systems and methods
- Patent Title (中): 微型工件的再分配层，以及相关的系统和方法
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Application No.: US13236372Application Date: 2011-09-19
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Publication No.: US09230859B2Publication Date: 2016-01-05
- Inventor: David Pratt
- Applicant: David Pratt
- Applicant Address: US ID Boise
- Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee Address: US ID Boise
- Agency: Perkins Cole LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/768 ; H01L21/48
Abstract:
Redistribution layers for microfeature workpieces, and associated systems and methods are disclosed. One method for processing a microfeature workpiece system includes positioning a pre-formed redistribution layer as a unit proximate to and spaced apart from a microfeature workpiece having an operable microfeature device. The method can further include attaching the redistribution layer to the microfeature workpiece and electrically coupling the redistribution layer to the operable microfeature device.
Public/Granted literature
- US20120007256A1 REDISTRIBUTION LAYERS FOR MICROFEATURE WORKPIECES, AND ASSOCIATED SYSTEMS AND METHODS Public/Granted day:2012-01-12
Information query
IPC分类:
